NA 022

DKE Deutsche Kommission Elektrotechnik Elektronik Informationstechnik in DIN und VDE

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Projekte von NA 022

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Dokumentnummer Beginn Titel Kontakt zu DIN
IEC 86B/3145/CDV 2010-03-05 IEC 61314-1 Ed. 4.0: Fibre optic interconnecting devices and passive components - Fibre optic fan-outs - Part 1-1: Blank detail specification Mehr  Kontakt zu DIN 
IEC 57/1054/DTS 2010-02-26 IEC 61968-2 TS Ed.2: Application integration at electric utilities - System interfaces for distribution management - Part 2: Glossary Mehr  Kontakt zu DIN 
IEC 49/928/DTS 2010-02-26 IEC/TS 61994-3 Ed.2: PIEZOELECTRIC, DIELECTRIC AND ELECTROSTATIC DEVICES AND ASSOCIATED MATERIALS FOR FREQUENCY CONTROL, SELECTION AND DETECTION- GLOSSARY - Part 3: Piezoelectric and dielectric oscillators Mehr  Kontakt zu DIN 
IEC 72/784/DC 2010-02-26 Proposal for an amendment to IEC 60730-1 Ed 4 Mehr  Kontakt zu DIN 
IEC 86A/1305/DC 2010-02-26 Third edition of IEC 60794-1-2 Mehr  Kontakt zu DIN 
IEC 87/429/DC 2010-02-26 Questionnaire on expanding the scope of IEC 61689 Ed 2 Mehr  Kontakt zu DIN 
IEC 106/197/NP 2010-02-26 New Work Item proposal on Specific Absorption Rate (SAR) in the Human Body from Wireless Communications Devices: Specific Requirements for Finite Difference Time Domain (FDTD) Modelling of Exposure from Vehicle Mounted Antennas Mehr  Kontakt zu DIN 
IEC 37/365/NP 2010-02-26 Future IEC 60099-9: Surge arresters - Part 9: Metal-oxide surge arresters without gaps for HVAC/HVDC converter and inverter stations Mehr  Kontakt zu DIN 
IEC 47F/46/NP 2010-02-26 (Future IEC 62047-17): Semiconductor devices - Micro-electromechanical devices - Part 17: Bulge test method for measuring mechanical properties of thin films Mehr  Kontakt zu DIN 
IEC 47F/47/NP 2010-02-26 (Future IEC 62047-18): Semiconductor devices - Micro-electromechanical devices - Part 18: Micro electro mechanical devises - Bending test methods of thin film materials Mehr  Kontakt zu DIN