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DKE Deutsche Kommission Elektrotechnik Elektronik Informationstechnik in DIN und VDE

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IEC 110/331/CD 2011-09-02 IEC 61747-10-1 Ed. 1 - Liquid crystal display devices - Part 10-1: Environmental , endurance and mechanical test methods - Mechanical Mehr  Kontakt zu DIN 
IEC 110/332/CD 2011-09-02 IEC 61747-10-2 Ed. 1 - Liquid crystal display devices - Part 10-2: Environmental, endurance and mechanical test methods - Environmental and endurance Mehr  Kontakt zu DIN 
IEC 91/996/NP 2011-09-02 Future IEC 62326-16: Printed boards-Device Embedded Substrate-Scope and Definition Mehr  Kontakt zu DIN 
IEC 91/997/NP 2011-09-02 Future IEC 62326-17; Printed boards-Device Embedded Substrate-TEG(test element group) Mehr  Kontakt zu DIN 
IEC 91/998/NP 2011-09-02 Future IEC 62326-18: Printed boards-Device Embedded Substrate-Test Method Mehr  Kontakt zu DIN 
IEC 91/999/NP 2011-09-02 Future IEC 62326-19: Printed boards-Device Embedded Substrate-Design Guide Mehr  Kontakt zu DIN 
IEC 110/333/CD 2011-09-02 IEC 62629-6-2 Ed. 1: 3D display devices - Part 6-2: Optical measuring methods for stereoscopic displays using glasses Mehr  Kontakt zu DIN 
IEC 82/665/NP 2011-09-02 Future IEC 6XXXX-1-2: Measurement procedures for materials used in photovoltaic modules - Part 1-2: Encapsulants - Measurement of volume resistivity of photovoltaic encapsulation and backsheet materials Mehr  Kontakt zu DIN 
IEC 82/666/NP 2011-09-02 Future IEC 6XXXX-1-4: Measurement procedures for materials used in Photovoltaic Modules - Part 1-4: Encapsulants - Measurement of optical transmittance and calculation of the solar-weighted photon transmittance, yellowness index, and UV cut-off frequency Mehr  Kontakt zu DIN 
IEC 86B/3284/NP 2011-09-02 Future IEC 61300-3-51 Ed. 1.0: Fibre optic interconnecting devices and passive components - Basic test and measurement procedures - Part 3-51: Examinations and measurements - Guide pin withdrawal force measurement method for rectangular ferrule multi-fibre connectors Mehr  Kontakt zu DIN 

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