Projekte von DKE/K 682

IEC 91/996/NP 2011-09-02 Future IEC 62326-16: Printed boards-Device Embedded Substrate-Scope and Definition Mehr  Kontakt zu DIN 
IEC 91/997/NP 2011-09-02 Future IEC 62326-17; Printed boards-Device Embedded Substrate-TEG(test element group) Mehr  Kontakt zu DIN 
IEC 91/998/NP 2011-09-02 Future IEC 62326-18: Printed boards-Device Embedded Substrate-Test Method Mehr  Kontakt zu DIN 
IEC 91/999/NP 2011-09-02 Future IEC 62326-19: Printed boards-Device Embedded Substrate-Design Guide Mehr  Kontakt zu DIN 
IEC 91/995/CD 2011-08-26 IEC 62326-15: Printed boards - Device Embedded Substrate - General electrical test guide for device embedded substrate with active devices, passive components (Capacitor, Resistor, Inductor, etc), Integrated passive device (IPD), and discrete packages. Mehr  Kontakt zu DIN 
IEC 91/987/CD 2011-07-15 Test method for erosion of wave soldering equipments by molten lead free solder alloy-Part 1: Erosion test method for the metallic material without surface treatment Mehr  Kontakt zu DIN 
IEC 91/965/NP 2011-02-18 Future IEC 61760-4 Ed.1: Classification, packaging, labelling and handling of moisture sensitive devices Mehr  Kontakt zu DIN 
IEC 91/968/NP 2011-02-18 Test method for erosion by molten lead free solder. Mehr  Kontakt zu DIN 
IEC 107/145/CD 2011-01-21 IEC 62239-1 TS Ed.1: Process management for avionics - Management plan - Part 1: Preparation and maintenance of an electronic components management plan Mehr  Kontakt zu DIN 
IEC 107/146/CD 2011-01-21 IEC 62668-1 TS Ed.1: Process management for avionics - Counterfeiting prevention - Part 1: Guidelines for avoiding the use of counterfeited, fraudulent and recycled electronic components Mehr  Kontakt zu DIN 

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