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Projekte von NA 022

IEC 15/515/CDV 2008-08-29 IEC 60674-3-8 Ed. 1.0: Specification for plastic films for electrical purposes - Part 3: Specifications for individual materials - Sheet 8: Requirements for balanced biaxially oriented polyethylenenaphthalate (PEN) films used for electrical insulation Mehr  Kontakt zu DIN 
IEC 91/805/NP 2008-08-29 Future IEC 61189-2-628 Ed. 1.0: Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-628: Mechanical test methods for printed board and assembly materials - Glass transition temperature of base material by dynamic mechanical analysis (DMA; bend and pull) Mehr  Kontakt zu DIN 
IEC 91/806/NP 2008-08-29 Future IEC 61189-2-719 Ed. 1.0: Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-716: Electrical test methods for printed board and assembly materials - Relative permittivity and dissipation factor (500MHz to 10GHz) Mehr  Kontakt zu DIN 
IEC 91/807/NP 2008-08-29 Future IEC 61189-2-720 Ed. 1.0: Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-720: Electrical test methods for printed board and assembly materials - Relative permittivity and dissipation factor (1MHz) Mehr  Kontakt zu DIN 
IEC 91/804/DC 2008-08-29 Review of 91/761/DC: "How to advance the PT 62468 document" Mehr  Kontakt zu DIN 
IEC 62D/894/FDIS 2008-08-29 ISO 80601-2-61 Ed.1: Medical electrical equipment - Part 2-61: Particular requirements for the basic safety and essential performance of pulse oximeter equipment Mehr  Kontakt zu DIN 
IEC 100/1444/DC 2008-08-22 Stage 0 project on identification and classification of resources Mehr  Kontakt zu DIN 
IEC 13/1434A/NP 2008-08-22 Comment received on 13/1434/NP: "Electricity metering - Payment systems - Part 32: Particular Requirements for Multi-Part Payment Metering Installations (Proposed Technical Specification 62055-32)" Mehr  Kontakt zu DIN 
IEC 47/1987/DC 2008-08-22 Maintenance of IEC 60747-1 Ed. 2.0: Semiconductor devices - Part 1: General Mehr  Kontakt zu DIN 
IEC 48B/2201/CD 2008-08-22 IEC 60512-99-001 Ed 1.0: Test schedule for engaging and separating connectors under electrical load - Part 99-001: Connectors used in twisted pair communication cabling with remote power Mehr  Kontakt zu DIN 

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