Projekte von NA 022

Dokumentnummer Beginn Titel Kontakt zu DIN
IEC 34B/1474/CD 2009-06-19 IEC 60838-1 A2 f3 Ed.4: Miscellaneous lampholders - Part 1: General requirements and tests - Proposal to amend IEC 60838-1 to include new definitions for reinforced insulated lampholders and to include the definitions for basic, supplementary, double and reinforced insulation Mehr  Kontakt zu DIN 
IEC 34B/1475/CD 2009-06-19 IEC 61184 A1 f1 Ed.3: Bayonet lampholders - Proposal for editorial changes to the IEC standard 61184 Bayonet lampholders regarding implementation of B15d & B22d designations Mehr  Kontakt zu DIN 
IEC 34B/1476/CD 2009-06-19 IEC 61184 A1 f2 Ed.3: Bayonet lampholders - Proposal for an amendment of IEC 61184 regarding deletion of reference to ISO for metric thread for nipples Mehr  Kontakt zu DIN 
IEC 34B/1477/CD 2009-06-19 IEC 61184 A1 f3 Ed.3: Bayonet lampholders - Proposal to amend IEC 61184 for marking and compliance of reinforced insulated lampholders Mehr  Kontakt zu DIN 
IEC 34B/1478/CD 2009-06-19 IEC 61184 A1 f4 Ed.3: Bayonet lampholders - Proposal to amend IEC 61184 to include new definitions for reinforced insulated lampholders Mehr  Kontakt zu DIN 
IEC 22E/129/FDIS 2009-06-19 IEC 61204-3 Ed.2: Low voltage power supplies, d.c. output - Part 3: Electromagnetic compatibility (EMC) Mehr  Kontakt zu DIN 
IEC 100/1572/NP 2009-06-19 Energy saving system for home appliances and home network devices - Part 1 : Architecture and requirements Mehr  Kontakt zu DIN 
IEC 77B/601/DC 2009-06-19 IEC 61000-4-6 - Future maintenance work Mehr  Kontakt zu DIN 
IEC 89/924/DC 2009-06-19 IEC TC89/WG12 is seeking information from laboratories that perform testing under IEC 60695-11-2 Ed.1:2003-07, Fire hazard testing - Part 11-2: Test flames - 1 kW nominal pre-mixed flame - Apparatus, confirmatory test arrangement and guidance Mehr  Kontakt zu DIN 
IEC 49/874/NP 2009-06-19 Future IEC 61338-1-5: Waveguide type dielectric resonators, Part 1-5: General information and test conditions - Measurement method of conductivity at interface between conductor layer and dielectric substrate at microwave frequency Mehr  Kontakt zu DIN