Project
IEC 60191-2/F63/Ed. 1: Proposed new package outline - Power Package with 34 Pins (to be published as Outline 181E)
Begin
2005-07-15
Planned document number
IEC 47D/713/FDIS
Responsible national committee
DKE/UK 631.4 - Gehäuse für Halbleiterbauelemente
Responsible international committee
IEC/SC 47D - Mechanical standardization for semiconductor devices
