Project
REPLACEMENT OF Document 47D/316/CD: Proposal for 60 and 90 pin P-FBGA (Plastic Fine pitch Ball Grid Array), 0,8 mm pitch
Abstract
This standard specifies a P-FBGA outline (Plastic Fine pitch Ball Grid Array) for 60 and 90 pin with 0,8 mm pitch.
Begin
1999-08-20
Planned document number
IEC 47D/316A/CD
Responsible national committee
DKE/UK 631.4 - Gehäuse für Halbleiterbauelemente
Responsible international committee
IEC/SC 47D - Mechanical standardization for semiconductor devices
