Project
IEC 60191-2/f66 Ed.1: Proposed new package outline - large power package with 4 load terminals, P-UMP-A4. To be published as outline 184B, if approved.
Begin
2010-11-19
Planned document number
IEC 47D/787/CD
Responsible national committee
DKE/UK 631.4 - Gehäuse für Halbleiterbauelemente
Responsible international committee
IEC/SC 47D - Mechanical standardization for semiconductor devices
