Project
IEC 60191-6-12 Ed.2: Mechanical standardization of semiconductor devices - Part 6-12: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for fine-pitch land grid array (FLGA)
Begin
2010-01-08
Planned document number
IEC 47D/784/CDV
Responsible national committee
DKE/UK 631.4 - Gehäuse für Halbleiterbauelemente
Responsible international committee
IEC/SC 47D - Mechanical standardization for semiconductor devices
