Project
IEC 60191-6-1 Ed.2: Mechanical Standardization Of Semiconductor Devices - Part 6-1: General rules for the preparation of outline drawings of surface mounted semiconductor device packages-Design guide for gull-wing lead terminals
Begin
2010-04-30
Planned document number
IEC 47D/804/CDV
Responsible national committee
DKE/UK 631.4 - Gehäuse für Halbleiterbauelemente
Responsible international committee
IEC/SC 47D - Mechanical standardization for semiconductor devices
