Overview

This part of IEC 60747 contains the requirements for isolated power semiconductor devices. These requirements apply in addition to the requirements given in other parts of IEC 60747 for non-isolated power semiconductor devices and in parts of IEC 60748 for ICs. There are no restrictions on the scope of this document. The standard differs from DIN EN 60747-15:2012-08 as follows: a) intelligent power semiconductor modules (IPMs) that were previously excluded in the first and second editions are now included in this document (Annex C); b) thermal resistance is described for each switch (6.2.4); c) a test of the insulation between the temperature sensor and the terminals as agreed with the user has been added (6.1.2). Application of this document increases investment security for manufacturers and users, provides testing laboratories and manufacturers with defined information for testing, and enhances product compatibility between manufacturers.

Document: references other documents

Responsible national committee

DKE/UK 631.1 - Einzel-Halbleiterbauelemente