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Standards [CURRENT]

DIN 50003
Adhesive bondings in electronic applications - Determination of thermal conductivity of materials for heat dissipation

Title (German)

Klebungen in elektronischen Anwendungen - Bestimmung der Wärmeleitfähigkeit von Materialien zur Wärmeableitung

Responsible national committee

NA 062-04-103 AA - Adhesive bondings in electronic applications

Edition 2024-06

Original language German

Price from 52.20 €

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Table of contents

PDF (DE)

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