Overview

This part of DIN EN 62047 is used to help prepare standards to describe devices and systems made by micromachining technology and includes but is not limited to: material characterization and handling; assembly and test; information about process control and measuring methods. Micro-electromechanical devices described in this standard are principally made on the basis of semiconductor materials. However, the specifications of this standard are also applicable to components for microsystems using materials other than semiconductor materials, for example, polymers, glasses, metals and ceramic materials. This part of DIN EN 62047 describes generic specifications for micro-electromechanical devices (MEMS) manufactured on the basis of semiconductors (MEMS) which form the basis for specifications given in other parts of this series for various types of MEMS applications, for example, sensors and RF-MEMS, but not for Opto-MEMS, Bio-MEMS, Micro-TAS and Power-MEMS. This standard contains specifications for general procedures for quality assessment to be used in the IECQ-CECC system, and general principles for describing and testing of electrical, optical, mechanical and environmental characteristics. The responsible Committee is K 631 "Halbleiterbauelemente" ("Semiconductor devices") of the DKE (German Commission for Electrical, Electronic and Information Technologies) at DIN and VDE.

Document: references other documents

Responsible national committee

DKE/K 631 - Halbleiterbauelemente  

Responsible international committee

IEC/TC 47 - Semiconductor devices