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Hydrogen Technologies Standards form the basic framework for market ramp-up
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Climate change Standards and specifications support climate targets
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Smart Farming Standards and specifications are drivers for the digitalization of agriculture
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Projects of DKE/K 682

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Document number	Begin	Title	Comment
IEC 107/109/NP	2009-07-31	Aerospace and military electronic systems containing lead-free solder - Part 2: Mitigation of the deleterious effects of tin in high-reliability electronic systems (IEC/PAS 62647-2) More	Comment
IEC 107/110/NP	2009-07-31	Process Management for Avionics - Management Plan for Counterfeit Electronic Parts Avoidance More	Comment
IEC 40/2011/DC	2009-07-03	Maintenance - call for comments/ proposals for amendment/ revision on IEC 60286-4, and call for experts for maintenance team More	Comment
IEC 40/2012/DC	2009-07-03	Maintenance - call for comments/ proposals for amendment/ revision on IEC 60286-6, and call for experts for maintenance team More	Comment
IEC 91/877/DC	2009-07-03	Maintenance - Call for comments/proposals for the revision of IEC 60194 Ed. 5.0, and call for experts for maintenance team More	Comment
IEC 107/105/DC	2009-06-12	Maintenance of IEC/TR 62240: Process management for avionics - Use of semiconductor devices outside manufacturers' specified temperature range More	Comment
IEC 91/869/DC	2009-05-29	Maintenance - Call for comments / proposals for amendment / revision on IEC 61191-1 Ed. 1.0 and IEC 61191-2 Ed. 1.0, and call for experts for maintenance team More	Comment
IEC 91/870/DC	2009-05-29	Maintenance - Call for comments / proposals for amendment / revision on IEC 61192-1 Ed. 1.0 and IEC 61192-2 Ed. 1.0, and call for experts for maintenance team More	Comment
IEC 91/848/DC	2009-02-06	Maintenance of IEC 60068-2-82 Ed. 1.0: ENVIRONMENTAL TESTING - Part 2-82: Tests - Test Tx: Whisker test methods for electronic and electric components More	Comment
IEC 91/903/CDV	2009-01-30	IEC 60068-2-83 Ed.1: Environmental Testing - Part 2-83: Tests-test Tf: Solderability testing of electronic components forsurface mounting devices (SMD) by the wetting balance method using solder paste More	Comment

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