Projects of DKE/K 682

Document number Begin Title Comment
DIN EN IEC 61249-2-53 2023-11-10 Materials for printed boards and other interconnecting structures - Part 2-53: Reinforced base materials clad and unclad - PTFE unfilled laminate sheets of defined flammability (vertical burning test), copper-clad (IEC 91/1978/CDV:2024); German and English version prEN IEC 61249-2-53:2024 More  Comment 
DIN EN IEC 61249-3-6 2023-08-10 Materials for printed boards and other interconnecting structures - Part 3-6: Sectional specification set for unreinforced base materials, clad and unclad - PTFE filled laminate sheets of defined flammability (vertical burning test), copper-clad (IEC 91/2015/CDV:2025); German and English version prEN IEC 61249-3-6:2025 More  Comment 
DIN EN IEC 61249-2-52 2023-01-11 Materials for printed boards and other interconnecting structures - Part 2-52: Reinforced base materials clad and unclad - Thermosetting hydrocarbon resin system, woven E-glass reinforced laminate sheets of defined flammability (vertical burning test), copper-clad (IEC 61249-2-52:2025); German version EN IEC 61249-2-52:2025 More  Comment 
DIN EN IEC 63215-4 2022-12-08 Endurance test methods for die attach materials - Part 4: Power cycling test method for die attach materials (near chip interconnection) applied to module type power electronic devices More  Comment 
DIN EN IEC 63215-3 2022-10-14 Endurance test methods for die attach materials - Part 3: Power cycling test method for die attach materials applied to discrete type power electronic devices More  Comment 
DIN EN IEC 63215-5 2022-02-22 Endurance test methods for die attach materials - Part 5: Temperature cycling test methods for die attach materials (system soldering interconnection) applied to module type power electronic devices (IEC 91/1770/CD:2021); Text in German and English More  Comment 
IEC 40/2196/CD 2013-01-25 IEC 60286-2 Ed.4: Packaging of components for automatic handling - Part 2: Tape packaging of components with unidirectional leads on continuous tapes More  Comment 
IEC 91/1083/CD 2013-01-25 IEC 62326-18 Ed.1: Printed boards - Part 18: Standard on Device Embedded Substrate - Test methods More  Comment 
IEC 107/197/CDV 2012-11-30 IEC 62396-3 Ed.1: Process management for avionics - Atmospheric radiation effects - Part 3: Optimising system design to accommodate the single event effects (SEE) of atmospheric radiation More  Comment 
IEC 91/1047/CD 2012-08-24 IEC 60068-2-58 Ed.4: Environmental testing - Part 2-58: Tests - Test Td - Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD) More  Comment 

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