• Hydrogen Technologies Standards form the basic framework for market ramp-up

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  • Climate change Standards and specifications support climate targets

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  • Smart Farming Standards and specifications are drivers for the digitalization of agriculture

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Projects of DKE/K 682

DIN EN IEC 61189-3-302 2023-08-31 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-302: Detection of plating defects in unpopulated circuit boards by computed tomography (CT) (IEC 61189-3-302:2025); German version EN IEC 61189-3-302:2025 More  Comment 
DIN IEC 61249-3-6 2023-08-10 Materials for printed boards and other interconnecting structures - Part 3-6: Sectional specification set for unreinforced base materials, clad and unclad-PTFE unfilled laminate sheets of defined flammability (vertical burning test), copper-clad More  Comment 
DIN EN IEC 61249-2-52 2023-01-11 Materials for printed boards and other interconnecting structures - Part 2-52: Reinforced base materials clad and unclad - Thermosetting hydrocarbon resin system, woven E-glass reinforced laminate sheets of defined flammability (vertical burning test), copper-clad (IEC 61249-2-52:2025); German version EN IEC 61249-2-52:2025 More  Comment 
DIN EN IEC 63215-4 2022-12-08 Endurance test methods for die attach materials - Part 4: Power cycling test method for die attach materials (near chip interconnection) applied to module type power electronic devices More  Comment 
DIN EN IEC 63215-3 2022-10-14 Endurance test methods for die attach materials - Part 3: Power cycling test method for die attach materials applied to discrete type power electronic devices More  Comment 
DIN EN IEC 63215-5 2022-02-22 Endurance test methods for die attach materials - Part 5: Temperature cycling test methods for die attach materials (system soldering interconnection) applied to module type power electronic devices (IEC 91/1770/CD:2021); Text in German and English More  Comment 
DIN EN IEC 62668-1 2021-12-23 Process management for avionics - Counterfeit prevention - Part 1: Avoiding the use of counterfeit, fraudulent and recycled electronic components (IEC 62668-1:2019 + AMD1:2024); German version EN IEC 62668-1:2019 + A1:2024 More  Comment 
DIN EN IEC 61188-6-3 2021-01-06 Circuit boards and circuit board assemblies - Design and use - Part 6-3: Land pattern design - Description of land pattern for through hole components (THT) (IEC 61188-6-3:2024); German version EN IEC 61188-6-3:2025 More  Comment 
IEC 40/2196/CD 2013-01-25 IEC 60286-2 Ed.4: Packaging of components for automatic handling - Part 2: Tape packaging of components with unidirectional leads on continuous tapes More  Comment 
IEC 91/1083/CD 2013-01-25 IEC 62326-18 Ed.1: Printed boards - Part 18: Standard on Device Embedded Substrate - Test methods More  Comment 

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