Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 3-302: Detection of plating defects in unpopulated circuit boards by computed tomography (CT) (IEC 91/1973/CDV:2024); German and English version prEN IEC 61189-3-302:2024
Abstract
This document specifies Computed tomography(CT) method for copper plating voids in metallized holes of PCB. This standard is applicable to metallized holes of PCB.
Begin
2023-08-31
Planned document number
DIN EN IEC 61189-3-302
Project number
02231810
Responsible national committee
DKE/K 682 - Aufbau- und Verbindungstechnik für elektronische Baugruppen
draft standard
Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 3-302: Detection of plating defects in unpopulated circuit boards by computed tomography (CT) (IEC 91/1973/CDV:2024); German and English version prEN IEC 61189-3-302:2024
2025-11
Order from DIN Media
