Project
Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 3-302: Computed tomography(CT) method for copper plating voids in metallized holes of PCB
Abstract
This standard specifies Computed tomography(CT) method for copper plating voids in metallized holes of PCB. This standard is applicable to metallized holes of PCB.
Begin
2023-08-31
Planned document number
DIN EN IEC 61189-3-302
Project number
02231810
Responsible national committee
DKE/K 682 - Aufbau- und Verbindungstechnik für elektronische Baugruppen
