Projects of DKE/K 682

IEC 46C/276/CD 1997-02-28 Amendment to IEC 1156-2 for values of characteristic impedance and structural return loss (SRL) and return loss (RL) More  Comment 
IEC 52/677/CD 1996-10-04 IEC 2326-3-1: Printed boards - Part 3: Rigid single and double-sided printed boards with interlayer connections - Section 1: Capability detail specification - Performance level A, B and C More  Comment 
IEC 52/794/CDV 1996-03-22 Amendment 2 to IEC 61189-2: Test methods for electrical materials, interconnection structures and assemblies - Part 2: Test methods for materials for interconnection structures More  Comment 
IEC 52/795/CDV 1996-03-22 Amendment 2 to IEC 61189-3: Test methods for electrical materials, interconnection structures and assemblies - Part 3: Test methods for interconnection structures More  Comment 
IEC 91/80/NP 1995-05-05   More  Comment 
IEC 107/106/PAS IEC/PAS 62647-1 Ed.1: Aerospace and military electronic systems containing lead-free solder - Part 1: Lead-free management More  Comment 
IEC 107/108/PAS IEC/PAS 62647-2 Ed.1: Aerospace and military electronic systems containing lead-free solder - Part 2: Mitigation of the deleterious effects of tin in high-reliability electronic systems More  Comment 
IEC 107/124/PAS IEC/PAS 62647-3 Ed.1: Aerospace and defence electronic systems containing lead free solder - Part 3: Performance testing for systems containing lead free solder and finishes More  Comment 
IEC 107/126/PAS Future IEC/PAS 62686-1 Ed.1: General Requirements for High Reliability Components - Part 1: Integrated Circuits and Discrete Semiconductors More  Comment 
IEC 91/956/PAS IEC/PAS 61249-6-3 Ed.1: Specification for finished fabric woven from ''E'' glass for printed boards More  Comment 

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