• Hydrogen Technologies Standards form the basic framework for market ramp-up

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  • Climate change Standards and specifications support climate targets

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  • Smart Farming Standards and specifications are drivers for the digitalization of agriculture

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Projects of DKE/K 682

IEC 91/469/NP 2004-07-02 Specification for Flexible Optical Board using Glass Fibre and its test methods More  Comment 
IEC 91/470/NP 2004-07-02 Specification for rigid optical board using planar waveguide and its test methods More  Comment 
IEC 91/471/NP 2004-07-02 Specification for optical board connector type SF using glass fibre More  Comment 
IEC 91/432/NP 2003-10-17 IEC xxx-xx: Test methods for lead-free solders - Part 1: Measurement of melting temperature ranges More  Comment 
IEC 91/433/NP 2003-10-17 IEC xxx-xx: Test methods for lead-free solder - Part 2: Testing of mechanical characteristics More  Comment 
IEC 91/407/NP 2003-07-11 IEC 61188-5-7 Design and use of printed boards and printed board assemblies - Part 5-7: Sectional requirements attachment (land/joint) considerations - components with post mounting leads on two sides (dips) More  Comment 
IEC 91/405/NP 2003-07-11 IEC 61249-1-1: Materials for printed boards and other interconnection structures - Part 1-1: Safety certification of base materials for rigid printed circuit boards More  Comment 
IEC 91/378/NP 2003-03-07 IEC 61190-1-6: Attachment materials for electronic assembly - Part-1-6: Requirements for electronic grade lead free solder alloys and fluxed and non-fluxed lead free solid solder for electronic soldering applications More  Comment 
IEC 91/379/NP 2003-03-07 IEC 61190-1-7: Attachment materials for electronic assembly - Part-1-7: Requirements for lead free solder pastes for high quality interconnections in electronics assembly More  Comment 
IEC 107/18/CD 2002-01-18 Process Management for Avionics - Technical Specification for Preparing an Electronic Components Management Plan More  Comment 

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