Projects of DKE/K 682

DIN EN IEC 61249-3-8 2026-09-25 Materials for circuit boards and other interconnecting structures - Part 3-8: Sectional specification set for unreinforced base materials, clad and unclad - Build-up film of defined dissipation factor (greater than 0,0050 and equal to or less than 0,0080 at 10 GHz) for rigid organic package substrate, unclad More  Comment 
DIN EN IEC 61249-3-7 2026-09-25 Materials for circuit boards and other interconnecting structures - Part 3-7: Sectional specification set for unreinforced base materials, clad and unclad - Build-up film of defined dissipation factor (greater than 0,0030 and equal to or less than 0,0050 at 10 GHz) for rigid organic package substrate, unclad More  Comment 
DIN EN IEC 61249-3-9 2026-09-25 Materials for circuit boards and other interconnecting structures - Part 3-9: Sectional specification set for unreinforced base materials, clad and unclad - Build-up film of defined dissipation factor (greater than 0,0080 and equal to or less than 0,0200 at 10 GHz) for rigid organic package substrate, unclad More  Comment 
DIN EN IEC 63761 2026-09-25 Thermography test method for defects circuit interconnection defects More  Comment 
DIN EN IEC 61249-2-56 2026-08-12 Materials for printed boards and other interconnecting structures - Part 2-56: Reinforced base materials clad and unclad - Non-halogenated epoxide modified bismaleimide/triazine with filler woven glass laminate sheets of low thermal expansion and flammability (vertical burning test), copper-clad for IC substrate More  Comment 
DIN EN IEC 60286-3 2026-04-29 Packaging of components for automatic handling - Part 3: Packaging of surface mount components on continuous tapes More  Comment 
DIN EN IEC 63726-1 2026-02-25 Sintering assembly technology - Part 1: Generic description More  Comment 
DIN EN IEC 60286-1/A2 2025-07-23 Packaging of components for automatic handling - Part 1: Tape packaging of components with axial leads on continuous tapes More  Comment 
DIN EN IEC 60286-3/A1 2025-07-23 Packaging of components for automatic handling - Part 3: Packaging of surface mount components on continuous tapes More  Comment 
DIN EN IEC 61191-10-2 2025-06-24 Printed board assemblies - Part 10-2: Guideline for the Output Profile Design in Laser-Assisted Bonding More  Comment 

TOP