• Hydrogen Technologies Standards form the basic framework for market ramp-up

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  • Climate change Standards and specifications support climate targets

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  • Smart Farming Standards and specifications are drivers for the digitalization of agriculture

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Projects of DKE/K 682

DIN EN IEC 60286-1/A2 2025-07-23 Packaging of components for automatic handling - Part 1: Tape packaging of components with axial leads on continuous tapes More  Comment 
DIN EN IEC 60286-3/A1 2025-07-23 Packaging of components for automatic handling - Part 3: Packaging of surface mount components on continuous tapes More  Comment 
DIN EN IEC 61191-10-2 2025-06-24 Printed board assemblies - Part 10-2: Guideline for the Output Profile Design in Laser-Assisted Bonding More  Comment 
DIN EN IEC 63569 2025-06-05 High-Level Test Description Table for Development of Production Test Programs More  Comment 
DIN EN IEC 62878-2-604 2025-05-22 Device embedding assembly technology - Part 2-604:Guideline for stacked electronic module - Evaluation method of heat transfer for stacked electronic module More  Comment 
DIN EN IEC 61249-2-55 2025-02-13 Materials for printed boards and other interconnecting structures - Part 2-55: Reinforced base materials clad and unclad - Non-halogenated modified or unmodified resin system, woven E-glass laminate sheets of defined dissipation factor (less than 0,005 at 10 GHz) and flammability (vertical burning test), copper-clad for high speed applications More  Comment 
DIN EN IEC 61189-5-501 2025-02-04 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-501: General test methods for materials and assemblies - Surface insulation resistance (SIR) testing of solder fluxes More  Comment 
DIN EN IEC 61190-1-3 2025-02-04 Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solder for electronic soldering applications More  Comment 
DIN EN IEC 61189-3-720 2024-12-12 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - - Part 3-720: Test methods for interconnection structures (circuit boards) - Transmission loss test method for high frequency multilayer circuit boards More  Comment 
DIN EN IEC 63609-1 2024-11-19 Measurement method used in thermal design for electronics assemblies - Part 1: Measurement requirements used in thermal design for the circuit boards or assemblies with miniaturized SMDs where the heat dissipation path to the board is dominant More  Comment 

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