Project
Packaging of components for automatic handling - Part 3: Packaging of surface mount components on continuous tapes
Abstract
This part of IEC 60286 is applicable to the tape packaging of electronic components without leads or with lead stumps, intended to be connected to electronic circuits. It includes only those dimensions that are essential for the taping of components intended for the above-mentioned purposes. This document also includes requirements related to the packaging of singulated die products including bare die and bumped die (flip chips).
Begin
2025-07-23
Planned document number
DIN EN IEC 60286-3/A1
Project number
02233316
Responsible national committee
DKE/K 682 - Aufbau- und Verbindungstechnik für elektronische Baugruppen
