Projects of DKE/UK 631.4

Document number Begin Title Comment
IEC 47D/286/FDIS 1995-09-08 IEC 60191-2: HSOP, reverse bend, heatslug up More  Comment 
IEC 47D/107/FDIS IEC 191-5: Mechanical standardization of semiconductor devices - Part 5: Recommendations applaying to integrated circuit packages using tape automated bonding (TAB) More  Comment 

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