Project
IEC 60191-2: HSOP, reverse bend, heatslug up
Abstract
The document specifies general rules for HSOP.
Begin
1995-09-08
Planned document number
IEC 47D/286/FDIS
Responsible national committee
DKE/UK 631.4 - Gehäuse für Halbleiterbauelemente
Responsible international committee
IEC/SC 47D - Mechanical standardization for semiconductor devices
