• Hydrogen Technologies Standards form the basic framework for market ramp-up

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  • Climate change Standards and specifications support climate targets

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  • Smart Farming Standards and specifications are drivers for the digitalization of agriculture

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Projects of DKE/UK 631.4

IEC 47D/418/CDV 2000-03-31 IEC 60191-2, F51, Ed.1: Plastic enhanced thin profile quad flatpack (HTQFP) outline family, heat slug up T-PQFP-G (If approved, to be published as Outline 152E-a-l) More  Comment 
IEC 47D/534/CDV 2000-03-31 IEC 60191-6-7 Ed.1: Mechanical standardization of semiconductor devices - Part 6-7: General rules for the dimensions of P-QFN More  Comment 
IEC 47D/440/FDIS 1999-12-17 IEC 60191-2/F47, Ed.1: Proposal for 3-Leaded SMD (Body Size D×E : 2.9×1.5 mm) Outline Family 162E More  Comment 
IEC 47D/316A/CD 1999-08-20 REPLACEMENT OF Document 47D/316/CD: Proposal for 60 and 90 pin P-FBGA (Plastic Fine pitch Ball Grid Array), 0,8 mm pitch More  Comment 
IEC 47D/314A/CD 1999-08-20 REPLACEMENT OF Document 47D/314/CD: Tape ball grid array package, 0,6 mm ball diameter family More  Comment 
IEC 47D/252/NP 1998-11-13 Proposal of the Japanese NC: BGA (Ball Grid Array) package measuring method More  Comment 
IEC 47D/229/NP 1998-07-17 Proposal of the USNC: Common package unit design guide for BGA packages More  Comment 
IEC 47D/214/NP 1998-02-06 Proposal of the Japanese NC: The individual standard for 0,8 mm pitch plastic fine pitch ball grid array (P-FBGA) family (Intended for inclusion into IEC 191-2) More  Comment 
IEC 47D/210/NP 1998-02-06 Proposal of the Japanese NC: The individual standard for 48 pins plastic fine pitch ball grid array (P-FBGA), 0,75 & 0,65 mm terminal pitch (Intended for inclusion into IEC 191-2) More  Comment 
IEC 47D/314/CD 1998-02-06 Tape Ball Grid Array package, 0.6 mm ball diameter family (Intended for inclusion in 60191-2) More  Comment 

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