• Hydrogen Technologies Standards form the basic framework for market ramp-up

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  • Climate change Standards and specifications support climate targets

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  • Smart Farming Standards and specifications are drivers for the digitalization of agriculture

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Projects of DKE/UK 631.4

IEC 47D/773/DC 2010-06-11 Maintenance - call for comments/ proposals on publications coming up for review and a call for experts More  Comment 
IEC 47D/803/CDV 2010-04-30 IEC 60191-4 Ed. 3: Mechanical Standardization Of Semiconductor Devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages More  Comment 
IEC 47D/804/CDV 2010-04-30 IEC 60191-6-1 Ed.2: Mechanical Standardization Of Semiconductor Devices - Part 6-1: General rules for the preparation of outline drawings of surface mounted semiconductor device packages-Design guide for gull-wing lead terminals More  Comment 
IEC 47D/784/CDV 2010-01-08 IEC 60191-6-12 Ed.2: Mechanical standardization of semiconductor devices - Part 6-12: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for fine-pitch land grid array (FLGA) More  Comment 
IEC 47D/829/FDIS 2009-10-23 IEC 60191-6-5 Ed.2: Mechanical standardization of semiconductor devices - Part 6-5: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for fine-pitch ball grid array (FBGA) More  Comment 
IEC 47D/780/CDV 2009-02-06 EC 60191-2 f65 Ed.1: Propsed New Package Outline-PlasticBottom-landed Small Outline Non-lead Package(P-BSO-N2/3/4/5/6) More  Comment 
IEC 47D/714/DC 2008-03-21 Categorization of the loose leaves of IEC 60191-2 Specifications More  Comment 
IEC 47D/677/NP 2006-12-15 NP-PAS: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for ball grid array (BGA) More  Comment 
IEC 47D/675/NP 2006-11-24 Proposed new package outline - 10 pin micro size Multimedia Card (MMC) outline MMCmicro 14×12×1,1 mm (Intended to become IEC 60191-2/F66, if approved) More  Comment 
IEC 47D/676/NP 2006-11-24 Proposed new package outline - 13 Pin full size Multimedia Card (MMC) Outline MMCplus 32×24×1,4 mm (Intended to become IEC 60191-2/F67, if approved) More  Comment 

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