• Hydrogen Technologies Standards form the basic framework for market ramp-up

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  • Climate change Standards and specifications support climate targets

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  • Smart Farming Standards and specifications are drivers for the digitalization of agriculture

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Projects of DKE/K 631

Document number Begin Title Comment
IEC 47F/105/NP 2011-09-30 Future IEC 62047-23: Semiconductor devices - Micro-electromechanical devices - Part 23: Test methods for determining residual stresses of MEMS films; wafer curvature and cantilever beam deflection methods More  Comment 
IEC 47F/95/NP 2011-07-29 Future IEC 62047-21: Semiconductor devices - Micro-electromechanical devices Part 21: Test method for Poisson's ratio of thin film MEMS materials More  Comment 
IEC 47F/96/NP 2011-07-29 Future IEC 62047-22: Semiconductor devices - Micro-electromechanical devices - Part 22: Electromechanical tensile test method for conductive thin films on flexible substrates More  Comment 
IEC 47F/91/NP 2011-07-22 Future IEC 62047-20: Semiconductor devices - Micro-electromechanical devices - Part 20: Gyroscopes More  Comment 
IEC 47F/155/FDIS 2011-02-18 IEC 62047-18 Ed. 1: Semiconductor devices - Micro-electromechanical devices - Part 18: Bend testing methods of thin film materials More  Comment 
IEC 47F/75/NP 2011-02-18 (Future IEC 62047-19) Semiconductor devices -Micro-electromechanical devices - Part 19: Electronic compasses More  Comment 
IEC 47/2080/NP 2010-11-12 IEC 60749-28: Electrostatic Discharge (ESD) Sensitivity Testing Direct contact charged device model (DC-CDM) More  Comment 
IEC 47/2073A/DTR 2010-09-10 IEC/TR 62258-4 Ed.2: Semiconductor die products - Part 4: Questionnaire for die users and suppliers More  Comment 
IEC 47A/853/DC 2010-08-06 Review and Maintenance - call for comments/ proposals on publications coming up for review and a call for experts More  Comment 
IEC 47/2064/NP 2010-07-16 Future IEC 62435: Long-term storage of electronic semiconductor devices More  Comment 

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