Projects of DKE/K 631

Document number Begin Title Comment
DIN EN IEC 60749-23 2024-10-09 Semiconductor devices - Mechanical and climatic test methods - Part 23: High temperature operating life (IEC 47/2881/CDV:2024); German and English version prEN IEC 60749-23:2024 More  Comment 
DIN EN IEC 60749-26 2024-10-02 Semiconductor devices - Mechanical and climatic test methods - Part 26: Electrostatic discharge (ESD) sensitivity testing - Human body model (HBM) (IEC 47/2882/CDV:2024); German and English version prEN IEC 60749-26:2024 More  Comment 
DIN EN IEC 62228-7 2024-09-11 Integrated circuits - EMC evaluation of transceivers - Part 7: CXPI transceivers More  Comment 
DIN EN IEC 60749-24 2024-08-01 Semiconductor devices - Mechanical and climatic test methods - Part 24: Accelerated moisture resistance - Unbiased HAST (IEC 47/2863/CDV:2024); German and English version prEN IEC 60749-24:2024 More  Comment 
DIN EN IEC 60749-7 2024-07-31 Semiconductor devices - Mechanical and climatic test methods - Part 7: Internal moisture content measurement and the analysis of other residual gases (IEC 47/2861/CDV:2024); German and English version prEN IEC 60749-7:2024 More  Comment 
DIN EN IEC 60749-21 2024-07-31 Semiconductor devices - Mechanical and climatic test methods - Part 21: Solderability (IEC 47/2862/CDV:2024); German and English version prEN IEC 60749-21:2024 More  Comment 
DIN EN IEC 63567-1 2024-07-12 Semiconductor devices Performance evaluation of semiconductor components and equipment - Part 1: Transmittance evaluation method of EUV pellicle More  Comment 
DIN EN IEC 62132-8 2024-07-12 Integrated circuits - Measurement of electromagnetic immunity - Part 8: Measurement of radiated immunity - IC stripline method (IEC 47A/1182/CDV:2025); German and English version prEN IEC 62132-8:2025 More  Comment 
DIN EN IEC 63287-4 2024-07-10 Semiconductor devices - Guidelines for reliability qualification plans - Part 4: Early failure assessment More  Comment 
DIN EN IEC 63581-1 2024-07-09 The recognition criteria of defects in polished indium phosphide wafers - Part 1: Classification of defects More  Comment 

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