• Hydrogen Technologies Standards form the basic framework for market ramp-up

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  • Climate change Standards and specifications support climate targets

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  • Smart Farming Standards and specifications are drivers for the digitalization of agriculture

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Projects of DKE/K 631

DIN EN IEC 63287-3 2022-11-25 Semiconductor devices - Generic semiconductor qualification guidelines - Part 3: Guidelines for reliability qualification plans for power semiconductor module (IEC 47/2873/CDV:2024); German and English version prEN IEC 63287-3:2024 More  Comment 
DIN EN IEC 62228-5-100 2022-06-29 Amendment 1 -Integrated circuits - EMC evaluation of transceivers - Part 5: Ethernet transceivers More  Comment 
DIN EN IEC 60749-34-1 2022-05-03 Semiconductor devices - Mechanical and climatic test methods - Part 34-1: Power cycling test for power semiconductor module (IEC 47/2759/CD:2022); Text in German and English More  Comment 
DIN IEC 63150-3 2022-05-03 Semiconductor devices - Measurement and evaluation methods of kinetic energy harvesting devices under practical vibration environment - Part 3: Human foot impact motion (IEC 47/2758/CD:2022); Text in German and English More  Comment 
DIN EN IEC 60749-20-1 2018-07-30 Semiconductor devices - Mechanical and climatic test methods - Part 20-1: Handling, packing, labelling and shipping of surface-mount devices sensitive to the combined effect of moisture and soldering heat (IEC 47/2488/CDV:2018); German and English version prEN IEC 60749-20-1:2018 More  Comment 
DIN EN 63011-1 2017-01-24 Integrated circuits - Three dimensional integrated circuits - Part 1: General conditions and definitions (IEC 47A/996/CD:2016) More  Comment 
DIN EN 63011-3 2017-01-24 Integrated circuits - Three dimensional integrated circuits - Part 3: A model and measurement conditions of through silicon via (IEC 47A/997/CD:2016) More  Comment 
IEC 47F/147A/CDV 2013-04-05 IEC 62047-21 Ed.1: Semiconductor devices - Micro-electromechanical devices - Part 21: Test method for Poisson's ratio of thin film MEMS materials More  Comment 
IEC 47F/148/CDV 2013-03-29 IEC 62047-22 Ed.1: Semiconductor devices - Micro-electromechanical devices - Part 22: Electromechanical tensile test method for conductive thin films on flexible substrates More  Comment 
IEC 47F/151/CD 2013-03-22 IEC 62047-16 Ed. 1: Semiconductor devices - Micro-electromechanical devices - Part 16: Test methods for determining residual stresses of MEMS films?wafer curvature and cantilever beam deflection methods More  Comment 

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