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IEC 47D/647/CD
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2006-02-17
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IEC 60191-2/f64, Ed 1: Proposed new package outline - Small outline package (SOT) 3-, 5- and 6-Lead SMD (to be published as 182E outline)
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Comment
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IEC 47D/713/FDIS
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2005-07-15
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IEC 60191-2/F63/Ed. 1: Proposed new package outline - Power Package with 34 Pins (to be published as Outline 181E)
More
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Comment
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IEC 47D/590/DC
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2004-08-27
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Proposed SC47D Scope Change (document also of interest to TC 48)
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Comment
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IEC 47D/539A/NP
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2004-01-30
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RESUBMISSION: Proposed new package outline, DDRII SDRAM Family, 1,00 mm contact pitch (ex 47D/539/NP)
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Comment
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IEC 47D/576/NP
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2004-01-30
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Proposed IEC 60191-6-xx: Glossary of semiconductor test and burn-in socket for BGA, LGA, FBGA and FLGA
More
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Comment
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IEC 47D/539/NP
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2003-04-11
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Proposed new package outline, DDRII SDRAM Family, 1,00 mm contact pitch
More
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Comment
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IEC 47D/540/NP
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2003-04-11
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Proposed new package outline, Plastic, small outline family, 1,27 mm pitch, 7,5 mm body width and 14, 16, 18, 20, 24 and 28 lead counts
More
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Comment
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IEC 47D/542/NP
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2003-04-11
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Proposed new package outline, Plastic small outline family, 1,27 mm pitch, 3,9 mm body width, 8, 14 and 16 leads
More
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Comment
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IEC 47D/543/NP
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2003-04-11
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Proposed new package outline, Plastic small outline family, 25 mil pitch, 150 mil body width, 14, 16, 18, 20, 24 and 28 leads
More
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Comment
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IEC 47D/523/NP
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2002-11-22
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Proposed new package outline for P-DHVQFN family. (Plastic Dual in-line compatible Heatsink Very thin Quad Flat Pack No Leads). If approved, to be included in IEC 60191-2 serie
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Comment
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