• Hydrogen Technologies Standards form the basic framework for market ramp-up

    More information
  • Climate change Standards and specifications support climate targets

    More information
  • Smart Farming Standards and specifications are drivers for the digitalization of agriculture

    More information

Projects of NA 022

Document number Begin Title Comment
DIN EN IEC 60529 2026-02-13 Degrees of protection provided by enclosures (IP Code) More  Comment 
DIN VDE V 0124-100 2026-02-13 Grid integration of generator plants - Low-voltage - Test requirements for generator units to be connected to and operated in parallel with low-voltage distribution networks More  Comment 
DIN EN 60730-2-3 2026-02-12 Automatic electrical controls for household and similar use - Part 2-3: Particular requirements for thermal protectors for ballasts for tubular fluorescent lamps More  Comment 
DIN EN IEC 60730-2-22 2026-02-12 Automatic electrical controls - Part 2-22: Particular requirements for thermal motor protectors More  Comment 
DIN EN IEC 61010-2-201 2026-02-12 Safety requirements for electrical equipment for measurement, control, and laboratory use - Part 2-201: Particular requirements for control equipment More  Comment 
DIN EN IEC 61400-24 2026-02-12 Wind energy generation systems - Part 24: Lightning protection More  Comment 
DIN EN IEC 60684-3-229 2026-02-11 Flexible insulating sleeving - Part 3: Specifications for individual types of sleeving - Sheet 229: Heat-shrinkable semi-flexible, polyvinylidene fluoride sleeving, flame retarded, fluid resistant, shrink ratio 2:1 More  Comment 
DIN EN IEC 60684-3-212 2026-02-11 Flexible insulating sleeving - Part 3: Specifications for individual types of sleeving - Sheet 212: Heat-shrinkable polyolefin sleevings More  Comment 
DIN EN IEC 60684-3-211 2026-02-11 Flexible insulating sleeving - Part 3: Specifications for individual types of sleeving - Sheet 211: Heat-shrinkable sleeving, semi-rigid polyolefin, shrink ratio 2:1 More  Comment 
DIN EN IEC 63546-1 2026-02-11 Required Specification Of Package Substrates For Advanced Semiconductor Packaging - Part 1: Current-Induced Quality Test Method for Package Substrate More  Comment 

TOP