Publications of DKE/K 682

DIN EN IEC 61760-3 2022-07 Standards Surface mounting technology - Part 3: Standard method for the specification of components for through-hole reflow (THR) soldering (IEC 61760-3:2021); German version EN IEC 61760-3:2021 More  Order from DIN Media
DIN EN IEC 62239-1 2019-06 Standards Process management for avionics - Management plan - Part 1: Preparation and maintenance of an electronic components management plan (IEC 62239-1:2018); German version EN IEC 62239-1:2018 More  Order from DIN Media
DIN EN IEC 62668-1 2026-08 Standards Process management for avionics - Counterfeit prevention - Part 1: Avoiding the use of counterfeit, fraudulent and recycled electronic components (IEC 62668-1:2019 + AMD1:2024); German version EN IEC 62668-1:2019 + A1:2024 More  Order from DIN Media
DIN EN IEC 62668-1 2021-04 Standards Process management for avionics - Counterfeit prevention - Part 1: Avoiding the use of counterfeit, fraudulent and recycled electronic components (IEC 62668-1:2019); German version EN IEC 62668-1:2019 More  Order from DIN Media
DIN EN IEC 62668-1/A1 2022-08 Draft standard Process management for avionics - Counterfeit prevention - Part 1: Avoiding the use of counterfeit, fraudulent and recycled electronic components (IEC 107/387/CD:2021); Text in German and English More  Order from DIN Media
DIN EN IEC 62668-2 2021-04 Standards Process management for avionics - Counterfeit prevention - Part 2: Managing electronic components from non-franchised sources (IEC 62668-2:2019); German version EN IEC 62668-2:2019 More  Order from DIN Media
DIN EN IEC 62878-1 2021-10 Standards Device embedding assembly technology - Part 1: Generic specification for device embedded substrates (IEC 62878-1:2019); German version EN IEC 62878-1:2019 More  Order from DIN Media
DIN EN IEC 62878-2-5 2021-04 Standards Device embedding assembly technology - Part 2-5: Guidelines - Implementation of a 3D data format for device embedded substrate (IEC 62878-2-5:2019); German version EN IEC 62878-2-5:2019 More  Order from DIN Media
DIN EN IEC 62878-2-602 2022-08 Standards Device embedding assembly technology - Part 2-602: Guideline for stacked electronic module - Evaluation method of inter-module electrical connectivity (IEC 62878-2-602:2021); German version EN IEC 62878-2-602:2021 More  Order from DIN Media
DIN EN IEC 62878-2-603 2026-03 Standards Device embedding assembly technology - Part 2-603: Guideline for stacked electronic module - Test method of intra-module electrical connectivity (IEC 62878-2-603:2025); German version EN IEC 62878-2-603:2025 More  Order from DIN Media

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