IEC 62047-15 Ed.1: Semiconductor devices - Micro-electromechanical devices - Part 15: Test method of bonding strength between PDMS and glass

IEC 60512-16-3 Ed.1: CONNECTORS FOR ELECTRONIC EQUIPMENT - TESTS AND MEASUREMENTS - Part 16-3: Mechanical tests on contacts and terminations - Test 16c: Contact bending strength

IEC 60512-16-4 Ed.1: CONNECTORS FOR ELECTRONIC EQUIPMENT - TESTS AND MEASUREMENTS - Part 16-4: Mechanical tests on contacts and terminations - Test 16d: Tensile strength (crimped connections)

IEC 60512-16-14 Ed.1: CONNECTORS FOR ELECTRONIC EQUIPMENT - TESTS AND MEASUREMENTS - Part 16-14: Mechanical tests on contacts and terminations - Test 16n: Bending strength fixed male tabs

IEC 60512-16-16 Ed.1: CONNECTORS FOR ELECTRONIC EQUIPMENT - TESTS AND MEASUREMENTS - Part 16-16: Mechanical tests on contacts and terminations - Test 16p: Torsional strength, fixed male tabs

IEC 60512-16-17 Ed.1: CONNECTORS FOR ELECTRONIC EQUIPMENT - TESTS AND MEASUREMENTS - Part 16-17: Mechanical tests on contacts and terminations - Test 16q: Tensile and compressive strength, fixed male tabs

IEC 60512-7-2 Ed. 1.0: Connectors for electronic equipment - Tests and measurements - Part 7-2: Impact tests (free connectors). test 7b: mechanical strength impact

Proposal of the Japanese NC: Testing method of measuring shear strength by punching out small specimen of bonded magnets

Future IEC 6XXXX-1-3 Ed.1: Measurement procedures for material used in photovoltaic modules - Part 1-3: Encapsulants - Measurement of dielectrc strength

IEC 62669 Ed.1: Case studies supporting IEC 62232 Ed.1 - Determination of RF field strength and SAR in the vicinity of radiocommunication base stations for the purpose of evaluating human exposure