NA 022
DKE German Commission for Electrical, Electronic & Information Technologies of DIN and VDE
Project
Semiconductor devices - Chip-scale testing for autonomous vehicles - Part 3: Thermal imagers
Abstract
This part of 63551-3 specifies testing methods and environments for evaluating the optical performance of thermal imaging sensor chips used in autonomous land vehicles. This document focuses on the chip-level characteristics of the thermal imaging device, including intrinsic sensor behavior, without covering module-level integration or external optics. Related standards such as ISO 26262: Road vehicles – Functional safety and IEEE 802.11p: V2X communication are outside the scope of this document.
Begin
2026-04-23
Planned document number
DIN EN IEC 63551-3
Project number
02233841
