NA 022
DKE German Commission for Electrical, Electronic & Information Technologies of DIN and VDE
DIN EN 61189-5 [CURRENT] references following documents:
| Document number | Edition | Title |
|---|---|---|
| IEC 60068-1 | 1988 | Environmental testing. Part 1: General and guidance More |
| IEC 61190-1-2 | 2002-03 | Attachment materials for electronic assembly - Part 1-2: Requirements for solder pastes for high-quality interconnections in electronics assembly More |
| IEC 62137 | 2004-07 | Environmental and endurance testing - Test methods for surface-mount boards of area array type packages FBGA, BGA, FLGA, LGA, SON and QFN More |
| IEC 60068-2-20 | 1979 | Environmental testing. Part 2: Tests. Test T: Soldering More |
| IEC 61189-1 | 1997-03 | Test methods for electrical materials, interconnection structures and assemblies - Part 1: General test methods and methodology More |
| IEC 61189-3 | 1997-04 | Test methods for electrical materials, interconnection structures and assemblies - Part 3: Test methods for interconnection structures (printed boards) More |
| IEC 61189-6 | 2006-07 | Test methods for electrical materials, interconnection structures and assemblies - Part 6: Test methods for materials used in electronic assemblies More |
| IEC 61190-1-1 | 2002-03 | Attachment materials for electronic assembly - Part 1-1: Requirements for soldering fluxes for high-quality interconnections in electronics assembly More |
| IEC 61190-1-3 | 2002-03 | Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications More |
| IEC 61249-2-7 | 2002-03 | Materials for printed boards and other interconnecting structures - Part 2-7: Reinforced base materials clad and unclad; Epoxide woven E-glass laminated sheet of defined flammability (vertical burning test), copper-clad More |
