NA 022
DKE German Commission for Electrical, Electronic & Information Technologies of DIN and VDE
DIN EN 60068-2-54 [Withdrawn] references following documents:
| Document number | Edition | Title |
|---|---|---|
| IEC 60068-1 | 1988 | Environmental testing. Part 1: General and guidance More |
| IEC 60068-2-20 | 1979 | Environmental testing. Part 2: Tests. Test T: Soldering More |
| IEC 61190-1-3 | 2002-03 | Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications More |
| IEC 60068-2-44 | 1995-01 | Environmental testing - Part 2: Tests; Guidance on test T: Soldering More |
| IEC 60068-2-58 | 2005-02 | Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD) More |
| IEC 60068-2-69 | 1995-12 | Environmental testing - Part 2: Tests - Test Te: Solderability testing of electronic components for surface mount technology by the wetting balance method More |
| IEC 61190-1-1 | 2002-03 | Attachment materials for electronic assembly - Part 1-1: Requirements for soldering fluxes for high-quality interconnections in electronics assembly More |
| IEC 61190-1-3 | 2002-03 | Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications More |
