NA 022
DKE German Commission for Electrical, Electronic & Information Technologies of DIN and VDE
DIN EN 60068-2-58 [Withdrawn] references following documents:
| Document number | Edition | Title |
|---|---|---|
| IEC 60068-1 | 1988 | Environmental testing. Part 1: General and guidance More |
| IEC 60068-2-20 | 1979 | Environmental testing. Part 2: Tests. Test T: Soldering More |
| IEC 60068-2-44 | 1995-01 | Environmental testing - Part 2: Tests; Guidance on test T: Soldering More |
| IEC 60068-2-54 | 1985 | Environmental testing. Part 2: Tests. Test TA: Soldering. Solderability testing by the wetting balance method More |
| IEC 60068-2-69 | 1995-12 | Environmental testing - Part 2: Tests - Test Te: Solderability testing of electronic components for surface mount technology by the wetting balance method More |
| IEC 60194 | 1999-04 | Printed board design, manufacture and assembly - Terms and definitions More |
| IEC 60749-20 | 2002-09 | Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic-encapsulated SMDs to the combined effect of moisture and soldering heat More |
| IEC 61190-1-1 | 2002-03 | Attachment materials for electronic assembly - Part 1-1: Requirements for soldering fluxes for high-quality interconnections in electronics assembly More |
| IEC 61190-1-2 | 2002-03 | Attachment materials for electronic assembly - Part 1-2: Requirements for solder pastes for high-quality interconnections in electronics assembly More |
| IEC 61190-1-3 | 2002-03 | Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications More |
