NA 022
DKE German Commission for Electrical, Electronic & Information Technologies of DIN and VDE
DIN EN 61190-1-2 [Withdrawn] references following documents:
| Document number | Edition | Title |
|---|---|---|
| EN 61190-1-1 | 2002-06 | Attachment materials for electronic assembly - Part 1-1: Requirements for soldering fluxes for high-quality interconnections in electronics assembly (IEC 61190-1-1:2002) More |
| EN 61190-1-3 | 2002-06 | Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications (IEC 61190-1-3:2002) More |
| IEC 60194 | 1999-04 | Printed board design, manufacture and assembly - Terms and definitions More |
| IEC 61190-1-1 | 2002-03 | Attachment materials for electronic assembly - Part 1-1: Requirements for soldering fluxes for high-quality interconnections in electronics assembly More |
| IEC 61190-1-3 | 2002-03 | Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications More |
| IEC 61191-1 | 1998-08 | Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies More |
| IEC 61191-2 | 1998-08 | Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies More |
| IEC 61191-3 | 1998-08 | Printed board assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies More |
| IEC 61191-4 | 1998-08 | Printed board assemblies - Part 4: Sectional specification - Requirements for terminal soldered assemblies More |
| ISO 5453 | 1980-12 | Ferroniobium; Specification and conditions of delivery More |
