Attention: Your browser doesn't support javascript or you have deactivated Javascript in your browser. Please enable Javascript in your browser in order to be able to use all functions of this website.

NA 022

DKE German Commission for Electrical, Electronic & Information Technologies of DIN and VDE

About DKE Projects Drafts Publications Documents withdrawn without replacement National committees European committees International committees

Standards [CURRENT]

IEC 60191-6-12
Mechanical standardization of semiconductor devices - Part 6-12: General rules for the preparation of outline drawings of surface mounted semiconductor device packages; Design guide for fine-pitch land grid array (FLGA); Rectangular type

Title (German)

Mechanische Normung von Halbleiterbauelementen - Teil 6-12: Allgemeine Regeln für die Erstellung von Gehäusezeichnungen von SMD-Halbleitergehäusen; Konstruktionsleitfaden für Feinraster-Land-Grid-Array (FLGA); Rechteckige Ausführung

Edition 2002-06

Original language English

Price On Request

Order from DIN Media

Table of contents

Economic benefits

DIN SPEC

Why do standards cost money?

Get involved in standardization

Terminology

DKE German Commission for Electrical, Electronic & Information Technologies of DIN and VDE

IEC 60191-6-12 Mechanical standardization of semiconductor devices - Part 6-12: General rules for the preparation of outline drawings of surface mounted semiconductor device packages; Design guide for fine-pitch land grid array (FLGA); Rectangular type

IEC 60191-6-12
Mechanical standardization of semiconductor devices - Part 6-12: General rules for the preparation of outline drawings of surface mounted semiconductor device packages; Design guide for fine-pitch land grid array (FLGA); Rectangular type