NA 022
DKE German Commission for Electrical, Electronic & Information Technologies of DIN and VDE
DIN EN 60603-9 [CURRENT] references following documents:
| Document number | Edition | Title |
|---|---|---|
| IEC 60326-10 | 1991-02 | Printed boards; part 10: specification for flex-rigid double-sided printed boards with through connections More |
| IEC 60326-11 | 1991-02 | Printed boards; part 11: specification for flex-rigid multilayer printed boards with through connections More |
| IEC 60326-12 | 1992-07 | Printed boards; part 12: specification for mass lamination panels (semi-manufactured multilayer printed boards) More |
| IEC 60326-2 | 1976 | Printed boards. Part 2 : Test methods More |
| IEC 60326-2A | 1980 | Printed boards. Part 2 : Test methods. More |
| IEC 60326-2B | 1982 | Printed boards. Part 2 : Test methods. More |
| IEC 60326-3 | 1980 | Printed boards. Part 3 : Design and use of printed boards More |
| IEC 60326-3A | 1982 | Printed boards. Part 3 : Design and use of printed boards. More |
| IEC 60326-4 | 1980 | Printed boards. Part 4 : Specification for single and double sided printed boards with plain holes More |
| IEC 60326-4 AMD 1 | 1989-10 | Printed boards; part 4: specification for single and double sided printed boards with plain holes; amendment 1 to IEC 60326-4:1980 More |
