NA 022
DKE German Commission for Electrical, Electronic & Information Technologies of DIN and VDE
DIN EN 61193-1 [CURRENT] references following documents:
| Document number | Edition | Title |
|---|---|---|
| EN 61191-1 | 1998-10 | Printed board assemblies - Part 1: Generic specification: Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies (IEC 61191-1:1998) More |
| EN 61191-2 | 1998-10 | Printed board assemblies - Part 2: Sectional specification: Requirements for surface mount soldered assemblies (IEC 61191-2:1998) More |
| EN 61191-3 | 1998-10 | Printed board assemblies - Part 3: Sectional specification: Requirements for through-hole mount soldered assemblies (IEC 61191-3:1998) More |
| EN 61191-4 | 1998-10 | Printed board assemblies - Part 4: Sectional specification: Requirements for terminal soldered assemblies (IEC 61191-4:1998) More |
| IEC 60194 | 1999-04 | Printed board design, manufacture and assembly - Terms and definitions More |
| IEC 61191-1 | 1998-08 | Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies More |
| IEC 61191-2 | 1998-08 | Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies More |
| IEC 61191-3 | 1998-08 | Printed board assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies More |
| IEC 61191-4 | 1998-08 | Printed board assemblies - Part 4: Sectional specification - Requirements for terminal soldered assemblies More |
| IEC 91/202/CDV ; IEC 61192-3:2000-10 ; IEC-PN 91/61192-3:2000-10 | 2000-10 | IEC 61192-3: Product performance requirements: Part 3: Sectional standard, workmanship requirements for through-hole mount soldered assemblies More |
