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DKE German Commission for Electrical, Electronic & Information Technologies of DIN and VDE

About DKE Projects Drafts Publications Documents withdrawn without replacement National committees European committees International committees

Standards [CURRENT]

IEC 60191-6-6
Mechanical standardization of semiconductor devices - Part 6-6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages; Design guide for fine pitch land grid array (FLGA)term

Title (German)

Mechanische Normung von Halbleiterbauelementen - Teil 6-6: Allgemeine Regeln für die Erstellung von Gehäusezeichnungen von SMD-Halbleitergehäusen; Konstruktionsleitfaden für Feinraster-Land-Grid-Array (FLGA)

Edition 2001-03

Original language English , French

Price On Request

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Table of contents

Economic benefits

DIN SPEC

Why do standards cost money?

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Terminology

DKE German Commission for Electrical, Electronic & Information Technologies of DIN and VDE

IEC 60191-6-6 Mechanical standardization of semiconductor devices - Part 6-6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages; Design guide for fine pitch land grid array (FLGA)term

IEC 60191-6-6
Mechanical standardization of semiconductor devices - Part 6-6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages; Design guide for fine pitch land grid array (FLGA)term