Attention: Your browser doesn't support javascript or you have deactivated Javascript in your browser. Please enable Javascript in your browser in order to be able to use all functions of this website.

NA 022

DKE German Commission for Electrical, Electronic & Information Technologies of DIN and VDE

About DKE Projects Drafts Publications Documents withdrawn without replacement National committees European committees International committees

Standards [Pre-order]

DIN EN IEC 62878-2-603
Device embedding assembly technology - Part 2-603: Guideline for stacked electronic module - Test method of intra-module electrical connectivity (IEC 62878-2-603:2025); German version EN IEC 62878-2-603:2025

Title (German)

Montageverfahren für eingebettete Bauteile - Teil 2-603: Leitfaden für gestapelte Elektronikmodule - Prüfverfahren für die elektrische Konnektivität innerhalb des Moduls (IEC 62878-2-603:2025); Deutsche Fassung EN IEC 62878-2-603:2025

Responsible national committee

DKE/K 682 - Aufbau- und Verbindungstechnik für elektronische Baugruppen

Edition 2026-03

Original language German

Price from 97.40 €

Order from DIN Media

Table of contents

Contact

Daniel Failer

Merianstr. 28
63069 Offenbach am Main

Tel.: +49 69 6308-418

Send message to contact

Economic benefits

DIN SPEC

Why do standards cost money?

Get involved in standardization

Terminology

DKE German Commission for Electrical, Electronic & Information Technologies of DIN and VDE

DIN EN IEC 62878-2-603 Device embedding assembly technology - Part 2-603: Guideline for stacked electronic module - Test method of intra-module electrical connectivity (IEC 62878-2-603:2025); German version EN IEC 62878-2-603:2025

Responsible national committee

Daniel Failer

DIN EN IEC 62878-2-603
Device embedding assembly technology - Part 2-603: Guideline for stacked electronic module - Test method of intra-module electrical connectivity (IEC 62878-2-603:2025); German version EN IEC 62878-2-603:2025