2. Getting involved
3. Standards Committees
4. DKE

DKE German Commission for Electrical, Electronic & Information Technologies of DIN and VDE

Overview

This part of IEC 61340 applies to organizations that: manufacture, process, assemble, install, package, label, service, test, inspect, transport or otherwise address electrical or electronic parts, assemblies and equipment with withstand voltages greater than or equal to 100 V human body model (HBM) and 200 V charge device model (CDM). Also, protection from isolated conductors is addressed by limiting the voltage on isolated conductors to less than 35 V. ESDS with lower withstand voltages can require additional control elements or adjusted limits. Processes designed to handle items that have lower ESD withstand voltage(s) can still claim compliance to this document. This document provides the requirements for an ESD control program. IEC TR 61340-5-2 provides guidance on the implementation of this document. This document does not apply to electrically initiated explosive devices, flammable liquids, gases, and powders. The standard differs from DIN EN 61340-5-1 (VDE 0300-5-1):2017-07 as follows: a) definitions have been added to the document; b) updates to product qualification requirements; c) subclause 5.3.3 now includes a reference to groundable static control garment systems; d) Table 2 has been replaced; e) subclause 5.3.4.2 has been updated to define what an insulator is; f) subclause 5.3.4.3 has been updated to include a definition for isolated conductor; g) Table 3 has been updated, technical items added, including a reference to IEC 61340-5-4 for compliance verification testing; h) Table 4 has been added as a summary of the requirements in IEC 61340-5-3 and to include requirements for compliance verification of packaging; i) Annex A has been replaced: the former Annex is no longer required. Annex A are examples of tailoring. The purpose of this document is to provide the administrative and technical requirements for establishing, implementing, and maintaining an ESD control program. Common sources of ESD include charged: personnel, conductors, common polymeric materials, and processing equipment. ESD damage can occur when: - a charged person or object comes into contact with an ESD sensitive device (ESDS); - an ESDS comes into direct contact with a highly conductive surface while exposed to an electrostatic field; - a charged ESDS comes into contact with another conductive surface which is at a different electrical potential. This surface can be grounded or ungrounded. Examples of ESDS are microcircuits, discrete semiconductors, thick and thin film resistors, hybrid devices, printed circuit boards and piezoelectric crystals.

Document: references other documents

Responsible national committee

DKE/K 185 - Elektrostatik