DKE German Commission for Electrical, Electronic & Information Technologies of DIN and VDE
DIN EN IEC 60384-20
Fixed capacitors for use in electronic equipment - Part 20: Sectional specification - Fixed metallized polyphenylene sulfide film dielectric surface mount DC capacitors (IEC 60384-20:2023); German version EN IEC 60384-20:2023
Festkondensatoren zur Verwendung in Geräten der Elektronik - Teil 20: Rahmenspezifikation - Oberflächenmontierbare Festkondensatoren für Gleichspannung mit metallisierter Polyphenyl-Sulfid-Folie als Dielektrikum (IEC 60384-20:2023); Deutsche Fassung EN IEC 60384-20:2023
Overview
This part of IEC 60384 applies to fixed surface mount capacitors for direct current, with metallized electrodes and polyphenylene sulfide dielectric for use in electronic equipment. These capacitors have metallized connecting pads or soldering strips and are intended to be mounted directly onto substrates for hybrid circuits or onto printed boards. They may have "self-healing properties" depending on conditions of use and are primarily intended for applications where the a.c. component is small with respect to the rated voltage. This standard specifies the preferred ratings and characteristics for the type of capacitor described, selects from IEC 60384-1 the appropriate quality evaluation procedures, tests, and measurement methods, and gives general requirements for operating performance. In detail specifications referencing this sectional specification, the severity of tests and requirements shall be at least equal to those specified in this specification; weaker ones are not permitted. Capacitors for radio interference suppression are not included, but are covered by IEC 60384-14. The standard differs from DIN EN 60384-20:2016-04 as follows: a) the entire document has been revised based on the ISO/IEC guidelines, Part 2:2021 and harmonization with other similar types of documents; b) the document structure has been organized to be consistent with the new sectional specification decided in TC 40; c) the tables and Clause 5 have been revised to avoid repetitions and contradictions; d) in Subclause 5.2 (Assembly) Subclauses 5.2.1, 5.2.2 and 5.2.3 have been added; e) in Subclause 5.5 (Shear test), Subclauses 5.5.1 and 5.5.2 have been added; f) in Subclause 5.14 (Solvent resistance of the component), Subclauses 5.14.1 and 5.14.2 have been added; in Table 8 and Table A.2, test 5.14 has been added before 5.7.5 (Final tests and requirements) in group 1A and in subgroup C1; g) In Subclauses 5.15 (Solvent resistance of marking), Subclauses 5.15.1 and 5.15.2 have been added; h) the tangent of the loss angle of a capacitor has been added to the soldering heat resistance test; i) the tables for batch and periodic tests, including the requirements, have been moved to Annex A; j) the test level (IL) of subgroup A1 has been revised. The document increases investment security for manufacturers and users through its application and provides test laboratories and manufacturers with defined information on testing, and product compatibility between manufacturers is improved.
