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DKE German Commission for Electrical, Electronic & Information Technologies of DIN and VDE
DIN EN IEC 61760-2 [CURRENT] references following documents:
| Document number | Edition | Title |
|---|---|---|
| IEC 60749-35 | 2006-07 | Semiconductor devices - Mechanical and climatic test methods - Part 35: Acoustic microscopy for plastic encapsulated electronic components More |
| IEC 60749-36 | 2003-02 | Semiconductor devices - Mechanical and climatic test methods - Part 36: Acceleration, steady state More |
| IEC 60749-37 | 2008-01 | Semiconductor devices - Mechanical and climatic test methods - Part 37: Board level drop test method using an accelerometer More |
| IEC 60749-38 | 2008-02 | Semiconductor devices - Mechanical and climatic test methods - Part 38: Soft error test method for semiconductor devices with memory More |
| IEC 60749-39 | 2021-11 | Semiconductor devices - Mechanical and climatic test methods - Part 39: Measurement of moisture diffusivity and water solubility in organic materials used for semiconductor components More |
| IEC 60749-4 | 2017-03 | Semiconductor devices - Mechanical and climatic test methods - Part 4: Damp heat, steady state, highly accelerated stress test (HAST) More |
| IEC 60749-40 | 2011-07 | Semiconductor devices - Mechanical and climatic test methods - Part 40: Board level drop test method using a strain gauge More |
| IEC 60749-41 | 2020-07 | Semiconductor devices - Mechanical and climatic test methods - Part 41: Standard reliability testing methods of non-volatile memory devices More |
| IEC 60749-42 | 2014-08 | Semiconductor devices - Mechanical and climatic test methods - Part 42: Temperature and humidity storage More |
| IEC 60749-44 | 2016-07 | Semiconductor devices - Mechanical and climatic test methods - Part 44: Neutron beam irradiated single event effect (SEE) test method for semiconductor devices More |
