NA 022
DKE German Commission for Electrical, Electronic & Information Technologies of DIN and VDE
DIN EN IEC 60068-2-20 ; VDE 0468-2-20:2022-07 [CURRENT] references following documents:
| Document number | Edition | Title |
|---|---|---|
| IEC 60068-1 | 2013-10 | Environmental testing - Part 1: General and guidance More |
| IEC 60068-2-2 | 2007-07 | Environmental testing - Part 2-2: Tests - Test B: Dry heat More |
| IEC 60068-2-66 | 1994-06 | Environmental testing - Part 2: Test methods - Test Cx: Damp heat, steady state (unsaturated pressurized vapour) More |
| IEC 60068-2-78 | 2012-10 | Environmental testing - Part 2-78: Tests - Test Cab: Damp heat, steady state More |
| IEC 61191-3 | 2017-05 | Printed board assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies More |
| IEC 61191-4 | 2017-07 | Printed board assemblies - Part 4: Sectional specification - Requirements for terminal soldered assemblies More |
| DIN EN IEC 61190-1-3 | 2018-09 | Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solder for electronic soldering applications (IEC 61190-1-3:2017); German version EN IEC 61190-1-3:2018 More |
| DIN EN 60068-1 ; VDE 0468-1:2015-09 | 2015-09 | Environmental testing - Part 1: General and guidance (IEC 60068-1:2013); German version EN 60068-1:2014 More |
| DIN EN 60068-2-2 ; VDE 0468-2-2:2008-05 | 2008-05 | Environmental testing - Part 2-2: Tests - Test B: Dry heat (IEC 60068-2-2:2007); German version EN 60068-2-2:2007 More |
| DIN EN 60068-2-58 ; VDE 0468-2-58 | 2018-09 | Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD) (IEC 60068-2-58:2015 + A1:2017); German version EN 60068-2-58:2015 + A1:2018 More |
