NA 022
DKE German Commission for Electrical, Electronic & Information Technologies of DIN and VDE
DIN EN IEC 61189-5-504 [CURRENT] references following documents:
| Document number | Edition | Title |
|---|---|---|
| IEC 60068-1 | 2013-10 | Environmental testing - Part 1: General and guidance More |
| IEC 60068-2-20 | 2021-03 | Environmental testing - Part 2-20: Tests - Tests Ta and Tb: Test methods for solderability and resistance to soldering heat of devices with leads More |
| IEC 60068-2-58 | 2015-03 | Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD) More |
| IEC 60079-7 | 2015-06 | Explosive atmospheres - Part 7: Equipment protection by increased safety "e" More |
| IEC 61189-5-502 | 2021-02 | Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 5-502: General test methods for materials and assemblies - Surface Insulation Resistance (SIR) testing of assemblies More |
| IEC 61190-1-3 | 2017-12 | Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non- fluxed solid solder for electronic soldering applications More |
