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DKE German Commission for Electrical, Electronic & Information Technologies of DIN and VDE
DIN EN IEC 60068-2-82 ; VDE 0468-2-82:2020-11 [CURRENT] references following documents:
| Document number | Edition | Title |
|---|---|---|
| IEC 60068-1 | 2013-10 | Environmental testing - Part 1: General and guidance More |
| IEC 60068-2-14 | 2009-01 | Environmental testing - Part 2-14: Tests - Test N: Change of temperature More |
| IEC 60512-16-21 | 2012-05 | Connectors for electronic equipment - Tests and measurements - Part 16-21: Mechanical tests on contacts and terminations - Test 16u: Whisker test via the application of external mechanical stresses More |
| IEC 61192-3 | 2002-12 | Workmanship requirements for soldered electronic assemblies - Part 3: Through-hole mount assemblies More |
| IEC 60068-2-20 | 2008-07 | Environmental testing - Part 2: Tests - Test T: Test methods for soldeability and resistance to soldering heat of devices with leads More |
| IEC 60068-2-58 | 2015-03 | Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD) More |
| IEC 60068-2-67 | 1995-12 | Environmental testing - Part 2: Tests - Test Cy: Damp heat, steady state, accelerated test primarily intended for components More |
| IEC 60068-2-78 | 2012-10 | Environmental testing - Part 2-78: Tests - Test Cab: Damp heat, steady state More |
| DIN EN 60068-1 ; VDE 0468-1:2015-09 | 2015-09 | Environmental testing - Part 1: General and guidance (IEC 60068-1:2013); German version EN 60068-1:2014 More |
| DIN EN 60068-2-58 ; VDE 0468-2-58 | 2018-09 | Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD) (IEC 60068-2-58:2015 + A1:2017); German version EN 60068-2-58:2015 + A1:2018 More |
