NA 022
DKE German Commission for Electrical, Electronic & Information Technologies of DIN and VDE
DIN EN IEC 61191-1 [CURRENT] references following documents:
| Document number | Edition | Title |
|---|---|---|
| IEC 61188-5-6 | 2003-01 | Printed boards and printed board assemblies - Design and use - Part 5-6: Attachment (land/joint) considerations; Chip carriers with J-leads on four sides More |
| IEC 61188-7 | 2017-04 | Printed boards and printed board assemblies - Design and use - Part 7: Electronic component zero orientation for CAD library construction More |
| IEC 61189-2 | 2006-05 | Test methods for electrical materials, interconnection structures and assemblies - Part 2: Test methods for materials for interconnection structures More |
| IEC 61190-1-2 | 2014-02 | Attachment materials for electronic assembly - Part 1-2: Requirements for soldering paste for high-quality interconnects in electronics assembly More |
| IEC 61193-1 | 2001-12 | Quality assessment systems - Part 1: Registration and analysis of defects on printed board assemblies More |
| IEC 61193-3 | 2013-01 | Quality assessment systems - Part 3: Selection and use of sampling plans for printed boards and laminate end-products and in-process auditing More |
| IEC 62326-1 ; QC 230000:2002-03 | 2002-03 | Printed boards - Part 1: Generic specification More |
| IEC 62326-4 ; QC 230500:1996-12 | 1996-12 | Printed boards - Part 4: Rigid multilayer printed boards with interlayer connections - Sectional specification More |
| IEC/PAS 62326-7-1 | 2007-04 | Performance guide for single- and double-sided flexible printed wiring boards More |
| IPC J-STD-006C ; IPC J-STD-006:2013-08-12 | 2013-08-12 | Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders for Electronic Soldering Applications More |
