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DKE German Commission for Electrical, Electronic & Information Technologies of DIN and VDE

DIN EN 60068-2-58 ; VDE 0468-2-58 [CURRENT] references following documents:

Document number Edition Title
IEC 60749-20 2008-12 Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic-encapsulated SMDs to the combined effect of moisture and soldering heat More 
IEC 61760-3 2010-03 Surface mounting technology - Part 3: Standard method for the specification of components for through hole reflow (THR) soldering More 
IEC 61760-4 2015-05 Surface mounting technology - Part 4: Classification, packaging, labelling and handling of moisture sensitive devices More 
IEC/TR 60068-3-12 2014-10 Environmental testing - Part 3-12: Supporting documentation and guidance - Method to evaluate a possible lead-free solder reflow temperature profile More