NA 022
DKE German Commission for Electrical, Electronic & Information Technologies of DIN and VDE
DIN EN 60068-2-58 ; VDE 0468-2-58 [CURRENT] references following documents:
| Document number | Edition | Title |
|---|---|---|
| IEC 60749-20 | 2008-12 | Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic-encapsulated SMDs to the combined effect of moisture and soldering heat More |
| IEC 61760-3 | 2010-03 | Surface mounting technology - Part 3: Standard method for the specification of components for through hole reflow (THR) soldering More |
| IEC 61760-4 | 2015-05 | Surface mounting technology - Part 4: Classification, packaging, labelling and handling of moisture sensitive devices More |
| IEC/TR 60068-3-12 | 2014-10 | Environmental testing - Part 3-12: Supporting documentation and guidance - Method to evaluate a possible lead-free solder reflow temperature profile More |