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DKE German Commission for Electrical, Electronic & Information Technologies of DIN and VDE
DIN EN 62435-2 ; VDE 0884-135-2:2017-10 [CURRENT] references following documents:
| Document number | Edition | Title |
|---|---|---|
| IEC 60749-20-1 | 2009-04 | Semiconductor devices - Mechanical and climatic test methods - Part 20-1: Handling, packing, labelling and shipping of surface-mount devices sensitive to the combined effect of moisture and soldering heat More |
| DIN EN 190000 | 1996-05 | Generic specification: Monolithic integrated circuits; German version EN 190000:1995 More |
| DIN EN 60749-20-1 | 2009-10 | Semiconductor devices - Mechanical and climatic test methods - Part 20-1: Handling, packing, labelling and shipping of surface-mount devices sensitive to the combined effect of moisture and soldering heat (IEC 60749-20-1:2009); German version EN 60749-20-1:2009 More |
| DIN EN 60749-21 | 2012-01 | Semiconductor devices - Mechanical and climatic test methods - Part 21: Solderability (IEC 60749-21:2011); German version EN 60749-21:2011 More |
| DIN EN 62435-5 ; VDE 0884-135-5:2017-10 | 2017-10 | Electronic components - Long-term storage of electronic semiconductor devices - Part 5: Die and wafer devices (IEC 62435-5:2017); German version EN 62435-5:2017 More |
| EN 190000 | 1995-06 | Generic specification: Monolithic integrated circuits More |
| IEC 60068-2-17 | 1994-07 | Basic environmental testing procedures - Part 2: Tests - Test Q: Sealing More |
| IEC 60068-2-20 | 2008-07 | Environmental testing - Part 2: Tests - Test T: Test methods for soldeability and resistance to soldering heat of devices with leads More |
| IEC 60410 | 1973 | Sampling plans and procedures for inspection by attributes More |
| IEC 60721-3-1 | 1997-02 | Classification of environmental conditions - Part 3: Classification of groups of environmental parameters and their severities - Section 1: Storage More |
