NA 022
DKE German Commission for Electrical, Electronic & Information Technologies of DIN and VDE
DIN EN 62435-1 ; VDE 0884-135-1:2017-10 [CURRENT] references following documents:
| Document number | Edition | Title |
|---|---|---|
| DIN EN 62258-6 | 2007-02 | Semiconductor die products - Part 6: Requirements for information concerning thermal simulation (IEC 62258-6:2006); German version EN 62258-6:2006 More |
| DIN EN 62435-2 ; VDE 0884-135-2:2017-10 | 2017-10 | Electronic components - Long-term storage of electronic semiconductor devices - Part 2: Deterioration mechanisms (IEC 62435-2:2017); German version EN 62435-2:2017 More |
| DIN EN 62435-5 ; VDE 0884-135-5:2017-10 | 2017-10 | Electronic components - Long-term storage of electronic semiconductor devices - Part 5: Die and wafer devices (IEC 62435-5:2017); German version EN 62435-5:2017 More |
| EN 190000 | 1995-06 | Generic specification: Monolithic integrated circuits More |
| IEC 60068-2-17 | 1994-07 | Basic environmental testing procedures - Part 2: Tests - Test Q: Sealing More |
| IEC 60068-2-20 | 2008-07 | Environmental testing - Part 2: Tests - Test T: Test methods for soldeability and resistance to soldering heat of devices with leads More |
| IEC 60410 | 1973 | Sampling plans and procedures for inspection by attributes More |
| IEC 60749-21 | 2011-04 | Semiconductor devices - Mechanical and climatic test methods - Part 21: Solderability More |
| IEC 61340-5-1 | 2007-08 | Electrostatics - Part 5-1: Protection of electronic devices from electrostatic phenomena - General requirements More |
| IEC 62258-1 | 2009-04 | Semiconductor die products - Part 1: Procurement and use More |
